CPU天梯图 2024 Intel CPU 挤牙膏进度 2008-2024 显卡天梯图 笔记本CPU天梯图 笔记本显卡天梯图 固态硬盘天梯图 硬盘天梯图 2024

| 内容 | |
| 型号 | Qualcomm Snapdragon 670 |
| GeekBench6 单核跑分 | 384 |
| GeekBench6 多核跑分 | 1248 |
| 安兔兔跑分 | 252493 |
| 发布时间 | 2018 |
| 品牌 | Qualcomm |
| 是否有 核显 | 带有核显 |
| GPU核显 | Adreno 615 |
| 类型 | Mobile/Embedded |
| 最主频GHz | 2.0 |
| 总核心 | 8 |
| TDP功耗(W) | 9 |
| nm | 10 |
| 4g | LTE Cat. 12 |
| 5g | No |
| wifi | 5 |
| bluetooth | 5.0 |
| videoCodecs | H.264, H.265, VP8, VP9 |
| navigation | GPS, GLONASS, Beidou, Galileo, QZSS, SBAS |
| modem | X12 LTE |
| 支持主板 | ARMv8-A |
| CPU介绍 | Qualcomm Snapdragon 670 – an 8-core chipset that was announced on August 8, 2018, and is manufactured using a 10-nanometer process technology. It has 2 cores Kryo 360 Gold (Cortex-A75) at 2000 MHz and 6 cores Kryo 360 Silver (Cortex-A55) at 1700 MHz. |
| viewCount | 1460 |
| 创建时间 | 2023-12-10 05:37:39 |
| 修改时间 | 2025-12-04 11:47:42 |