CPU天梯图 2024 Intel CPU 挤牙膏进度 2008-2024 显卡天梯图 笔记本CPU天梯图 笔记本显卡天梯图 固态硬盘天梯图 硬盘天梯图 2024
Qualcomm Snapdragon 870 CPU天梯图 单核 性能 参数 多核 跑分 排名
cpu插槽类型大全 至强cpu天梯图
| 内容 | |
| 型号 | Qualcomm Snapdragon 870 |
| GeekBench6 单核跑分 | 1147 |
| GeekBench6 多核跑分 | 3340 |
| 安兔兔跑分 | 815334 |
| 发布时间 | 2021 |
| 品牌 | Qualcomm |
| 是否有 核显 | 带有核显 |
| GPU核显 | Adreno 650 |
| 类型 | Mobile/Embedded |
| 最主频GHz | 3.2 |
| 总核心 | 8 |
| l1cache | 512 |
| L2缓存 | 1024 KB |
| L3缓存 | 4096 KB |
| TDP功耗(W) | 6 |
| nm | 7 |
| 4g | LTE Cat. 22 |
| 5g | Yes |
| wifi | 6 |
| bluetooth | 5.2 |
| videoCodecs | H.264, H.265, VP8, VP9 |
| navigation | GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC |
| modem | X55 |
| 支持主板 | ARMv8.2-A |
| CPU介绍 | Qualcomm Snapdragon 870 – an 8-core chipset that was announced on January 19, 2021, and is manufactured using a 7-nanometer process technology. It has 1 core Kryo 585 Prime (Cortex-A77) at 3200 MHz, 3 cores Kryo 585 Gold (Cortex-A77) at 2420 MHz, and 4 cores Kryo 585 Silver (Cortex-A55) at 1800 MHz. |
| viewCount | 2322 |
| 创建时间 | 2023-12-10 05:37:33 |
| 修改时间 | 2025-11-07 15:29:07 |
打开 哈希空间 微信小程序中查看更佳